We spoke with Dr Brad Ferguson at ECTC 2026 to discuss SkyWater Technology's growing advanced packaging capabilities, including fan-out wafer-level packaging (FOWLP), hybrid bonding and interposer fabrication.

Brad explains SkyWater's unique "Technology-as-a-Service" model, where the company works closely with customers to co-develop customised process technologies before moving into manufacturing. We also discuss the rollout of SkyWater's new FOWLP production line and what it means for future customer engagement.