We caught up with PARMI at ECTC 2026 to discuss the company's expansion from semiconductor back-end inspection into wafer-level inspection and advanced packaging.

With over 30 years of experience in optical inspection, PARMI explains how changing industry trends have driven the development of new inspection platforms, including its off-the-shelf wire bond inspection system and the new ARTEON wafer inspection platform. The conversation also explores how AI-powered software is enhancing inspection capabilities today, with a fully AI-powered wafer inspection solution on the horizon.