We caught up with NHanced Semiconductors at ECTC 2026 to discuss the company's role as a pure-play advanced packaging foundry and the technologies driving the next generation of semiconductor integration.

The conversation covers silicon and glass interposers, hybrid bonding, wafer-to-wafer and die-to-wafer integration, as well as the growing importance of Foundry 2.0 and chiplet-based architectures. We also discuss NHanced's plans to scale its advanced packaging capabilities, including a new high-volume interposer facility in Indiana and continued investment in hybrid bonding technologies with the critical tools to operate domestically.