We caught up with AIM Photonics at ECTC 2026 to discuss its end-to-end silicon photonics ecosystem, spanning design enablement, wafer fabrication, advanced packaging and test.

The conversation explores how AIM Photonics is helping customers accelerate development by integrating packaging and testing considerations at the design stage, alongside its expanding advanced packaging capabilities, including hybrid bonding, die-to-wafer integration, flip-chip assembly and photonic wire bonding. We also discuss the organisation's ongoing expansion and how its flexible manufacturing model supports the transition from prototype to production.