Google AI push boosts packaging demand
Google's reported plans to scale production of its next-generation AI chips are expected to drive demand for advanced packaging technologies and multi-die integration.
Google is reportedly planning to produce between 12 million and 15 million ninth-generation Tensor Processing Units (TPUs) by 2028, a scale that could rival Nvidia's projected AI accelerator shipments and significantly increase demand for advanced semiconductor packaging.
According to a research note from Fubon, the TPU v9 will feature a four-die architecture, reflecting the industry's shift toward multi-die chiplet designs for AI processors.
Scaling production to the reported volumes is expected to more than double Google's packaging capacity requirements compared with 2027.
The report suggests that advanced packaging capacity could become a key constraint, with TSMC potentially unable to meet the anticipated demand alone.
Intel Foundry is reportedly positioned to play a role after securing orders to produce millions of Google TPUs, following successful evaluations of its advanced packaging technologies.
The reported partnership highlights the growing importance of advanced packaging in next-generation AI hardware, where technologies such as Intel's EMIB and TSMC's CoWoS platforms are enabling the integration of multiple high-performance compute dies within a single package.
While Google has not officially confirmed its production plans, the reported expansion underscores how advanced packaging has become a critical enabler for scaling AI infrastructure and next-generation accelerator deployments.
