Micross to acquire AEMtec
The acquisition expands Micross' advanced packaging, photonics and optoelectronics capabilities while strengthening its manufacturing footprint in Europe.
Micross Components has entered into a definitive agreement to acquire Germany-based AEMtec GmbH, expanding its advanced packaging and high-reliability microelectronics capabilities while establishing a larger presence in continental Europe.
AEMtec provides micro- and optoelectronic modules, advanced packaging, test and assembly services for applications spanning aerospace, defence, medical, communications and industrial markets.
Its expertise includes wafer back-end services, wafer testing, chip-on-board, flip-chip assembly, 3D integration and optoelectronic packaging, supported by manufacturing facilities in Berlin, Dresden and Boston.
Micross said the acquisition will broaden its portfolio of advanced packaging, photonics and test capabilities while enhancing its ability to support customers with high-reliability microelectronic solutions.
The transaction also expands the company's European manufacturing and engineering footprint, strengthening support for customers across the region.
"We are excited to welcome AEMtec to the Micross family, as their world-class expertise in advanced packaging, photonics and optoelectronics will augment our capabilities and accelerate our ability to deliver cutting-edge solutions to our customers," said Jim Cannon, CEO of Micross.
The transaction is expected to close in the second half of 2026, subject to customary regulatory approvals. Financial terms were not disclosed.
