Qnity expands advanced packaging
The company has joined imec's research programme to accelerate next-generation materials innovation for advanced packaging and AI-driven semiconductor technologies.
Qnity Electronics has announced expanded investment in next-generation semiconductor technologies through its participation in imec's research programme, strengthening its long-term innovation strategy for advanced packaging.
The collaboration provides Qnity with access to imec's research portfolio, advanced infrastructure and global ecosystem of industry and academic partners, supporting the co-development of technologies for future AI and high-performance computing applications.
The company said its investment is focused on the industry's transition toward chiplet-based architectures, high-bandwidth memory (HBM), wafer-level packaging, 3D stacking and heterogeneous integration.
Qnity's portfolio spans materials for patterning, planarization, metallization and interconnect technologies, alongside advanced packaging solutions and thermal management.
"As computing moves toward shrink and stack, advanced packaging is becoming one of the most critical frontiers for performance, efficiency and scale," said Randy King, chief technology officer at Qnity.
"Our collaboration with imec gives us deeper access to the ecosystem, infrastructure, experts and partnerships needed to help shape that future, bringing next-generation materials innovation to our customers."
Qnity said the collaboration reinforces its long-term innovation roadmap and positions the company to help address the increasing performance and efficiency demands of AI, high-performance computing and data-intensive applications.
