MetaOptics and Elsoft partner
MetaOptics Ltd. has partnered with Elsoft Research Berhad to develop automated manufacturing, assembly and test solutions for high-volume metalens production, targeting applications including co-packaged optics, smartphone cameras and augmented reality devices.
The collaboration will focus on three equipment platforms: a 12-inch direct laser writer for mass production of metalenses, wafer-level automated metalens testing systems, and an integrated assembly and test platform for metalens modules.
The solutions are designed to improve production throughput, yield and scalability while supporting existing semiconductor manufacturing processes.
The direct laser writer platform is intended to enable simultaneous fabrication of hundreds of metalenses for high-volume co-packaged optics production.
Meanwhile, the wafer-level metrology systems will automatically measure key optical parameters, including point-spread function, modulation transfer function, throughput and uniformity across visible, near-infrared and short-wave infrared wavelengths.
The partners are also developing an automated module assembly system that combines sub-micron active alignment, UV-cured bonding and embedded optical testing in a single production flow.
The platform is designed to assemble metalenses onto flexible circuit packages and image sensors for volume manufacturing.
MetaOptics said the partnership aims to shorten development cycles, improve manufacturing yields and accelerate the transition from prototyping to commercial-scale production.
The company is also in discussions with potential foundry customers in the U.S., Japan and Europe for its metalens fabrication and testing equipment.
