Applied Materials and KIOXIA partner
Applied Materials and KIOXIA are partnering at Applied’s EPIC Center in Silicon Valley to develop next-generation memory technologies, with a focus on advanced structures, multi-chip stacking and packaging for AI applications.
The collaboration will target higher-density memory architectures and improved performance through advances in memory-cell structures, multi-chip integration and materials engineering.
A key focus will be advanced packaging for stacked memory, aimed at improving integration and interconnect performance in complex multi-die solutions. The companies will also investigate materials and processes designed to support the manufacturability of next-generation memory technologies at scale.
Applied Materials said the partnership will bring together KIOXIA’s memory expertise with its materials engineering capabilities to address the growing requirements for higher memory density, bandwidth and energy efficiency in AI infrastructure.
The work will be carried out through Applied’s EPIC (Equipment and Process Innovation and Commercialization) Center, which is designed to accelerate semiconductor equipment and process development from R&D through to high-volume manufacturing.
KIOXIA’s participation adds memory-device expertise to the EPIC Center ecosystem, which includes semiconductor manufacturers, chip designers, equipment partners and universities.
